A nоnmetаl plаte (kn = 0.05 W/mK) is firmly аttached tо a cоpper-silicon plate (kc= 36 W/mK), as illustrated in Figure 1. The bottom surface of the copper-silicon plate (surface 1) is subjected to a uniform heat flux. The top surface of the nonmetal plate (surface 2) is maintained at 35 °C and exposed to ambient air and surroundings at a temperature of 15°C. The convective heat transfer coefficient is 10 W/m²·K, and the surface area of the plate is 10-3 m2. Additionally, the emissivity of the top surface is ε = 0.4. Assume steady-state one-dimensional heat transfer through the plates and answer the following questions. (a) Construct a thermal resistance network that accurately represents the physical system described in the problem and illustrated in Figure 1. Identify the resistances due to conduction, convection, and radiation. (b) Calculate the total thermal resistance using the thermal resistance network from part (a). (c) Determine the total rate of heat transfer through the plates. (d) Based on your analysis, evaluate the temperatures at surface 1 (T₁), and the interface (Ti).